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YUHUAN Co., Ltd.

ទំព័រដើម>មជ្ឈមណ្ឌលផលិតផល>ម៉ាស៊ីនកិន CNC>ម៉ាស៊ីនកិនមុខទ្វេ

មជ្ឈមណ្ឌលផលិតផល

https://www.yuhuancnc.com/upload/product/1690274107715613.jpg
YHJ2M77120 ម៉ាស៊ីនកិនទ្វេបញ្ឈរភាពជាក់លាក់ខ្ពស់។

YHJ2M77120 ម៉ាស៊ីនកិនទ្វេបញ្ឈរភាពជាក់លាក់ខ្ពស់។


មុខងារចម្បង:

Yhj2m77120 high precision vertical double-sided grinder is a kind of double-sided thinning machine tool developed and designed by ourselves. The machine tool can be widely used in silicon carbide, silicon, quartz crystal, sapphire and other non-metallic hard brittle materials made of thin parts, and the valve plate, valve plate, cylinder piston rings, oil pump blades and other metal parts of double-sided thinning grinding.


ប្រភេទ: មជ្ឈមណ្ឌលផលិតផល
ពាក្យ​គន្លឹះ៖ Yuhuan

សាកសួរ
គ្រឿងបន្លាស់ម៉ាស៊ីនធម្មតា។

រូបភាព -២

ស៊ីឡាំងកាបូអ៊ីត

រូបភាព -២

គ្រីស្តាល់រ៉ែថ្មខៀវ

រូបភាព -២

ត្បូងកណ្តៀង

លក្ខណៈពិសេសចម្បង

● The lower disc adopts the structure of hydrostatic turntable bearing in the axial direction, which has the characteristics of high precision and high rigidity.

● The inner and outer gear rings of the lower disc are driven by servo motor independently, the process can be adjusted in a wide range, and the process parameters can be adjusted flexibly according to different material products.

● The upper plate adopts floating cylinder mechanism to adjust balance, and four groups of floating cylinders are arranged symmetrically and evenly, which can improve the machining efficiency on the premise of keeping the machining precision.

● The upper and lower disks are equipped with independent cooling water channel cooling grinding disks. The upper and lower disks are equipped with multi-point temperature sensors (with wireless sensors) , ensure that the temperature of the grinding disc is uniform and constant.

● Configuration on-line detection system (optional) , to achieve simultaneous processing and detection, processing qualified rate is high.

ប៉ារ៉ាម៉ែត្របច្ចេកទេស
គម្រោងប៉ា​រ៉ា​មែ​ត្រ
Single wafer substrate thickness difference TTV≤1.5
Thickness difference between wafer substrate and substrate(μm)≤3
minimum thickness of wafer substrate (μm)350
wafer substrate flatness(μm)≤1.5
wafer substrate after chemical polishing roughness(nanometer)8Ra១.៦
disc flatness (mm)≤0.005
disc maximum loading pressure(t)2
disc maximum stroke(mm)500
disc size(mm)Φ១៣.៥ * Φ១០.២ * ០.៤
disc bounce(mm)≤0.01
disc size(mm)Φ១៣.៥ * Φ១០.២ * ០.៤
disc lift height (mm)24 ~ 28


គម្រោងប៉ា​រ៉ា​មែ​ត្រ
Maximum load bearing(t)7
upper disk speed (RPM)5 ~ 80
lower disk speed(RPM)5 ~ 80
upper disk motor power(KW)18.5
lower disk motor power(KW)18.5
sun wheel speed(RPM)5 ~ 100
sun wheel motor power(KW)4.4
outer ring gear speed(RPM)1 ~ 10
outer ring motor power(KW)4.4
Number of rotors (units)5
wafer processing specifications (inches)≤8”(For proofing)6”(Commonly used)
weight of equipment (t)7.5

សាកសួរ

ប្រភេទក្តៅ