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YHJ2M77120 Esmoladora vertical de doble cara d'alta precisió

YHJ2M77120 Esmoladora vertical de doble cara d'alta precisió


Funció principal:

Yhj2m77120 high precision vertical double-sided grinder is a kind of double-sided thinning machine tool developed and designed by ourselves. The machine tool can be widely used in silicon carbide, silicon, quartz crystal, sapphire and other non-metallic hard brittle materials made of thin parts, and the valve plate, valve plate, cylinder piston rings, oil pump blades and other metal parts of double-sided thinning grinding.


Categoria: Centre de Productes
Paraules clau: Yuhuan

MISSATGE
Peces mecanitzades típiques

imatge-1

Carbur de silici

imatge-2

Cristall de quars

imatge-3

safir

Característica principal

● The lower disc adopts the structure of hydrostatic turntable bearing in the axial direction, which has the characteristics of high precision and high rigidity.

● The inner and outer gear rings of the lower disc are driven by servo motor independently, the process can be adjusted in a wide range, and the process parameters can be adjusted flexibly according to different material products.

● The upper plate adopts floating cylinder mechanism to adjust balance, and four groups of floating cylinders are arranged symmetrically and evenly, which can improve the machining efficiency on the premise of keeping the machining precision.

● The upper and lower disks are equipped with independent cooling water channel cooling grinding disks. The upper and lower disks are equipped with multi-point temperature sensors (with wireless sensors) , ensure that the temperature of the grinding disc is uniform and constant.

● Configuration on-line detection system (optional) , to achieve simultaneous processing and detection, processing qualified rate is high.

paràmetre tècnic
projecteParàmetre
Single wafer substrate thickness difference TTV≤ 1.5
Thickness difference between wafer substrate and substrate(μm)≤ 3
minimum thickness of wafer substrate (μm)350
wafer substrate flatness(μm)≤ 1.5
wafer substrate after chemical polishing roughness(nanometer)≤Ra8
disc flatness (mm)≤ 0.005
disc maximum loading pressure(t)2
disc maximum stroke(mm)500
disc size(mm)Φ1120 * Φ385 * 50
disc bounce(mm)≤ 0.01
disc size(mm)Φ1120 * Φ385 * 50
disc lift height (mm)24 ~ 28


projecteParàmetre
Maximum load bearing(t)7
upper disk speed (RPM)5 ~ 80
lower disk speed(RPM)5 ~ 80
upper disk motor power(KW)18.5
lower disk motor power(KW)18.5
sun wheel speed(RPM)5 ~ 100
sun wheel motor power(KW)4.4
outer ring gear speed(RPM)1 ~ 10
outer ring motor power(KW)4.4
Number of rotors (units)5
wafer processing specifications (inches)≤8”(For proofing)6”(Commonly used)
weight of equipment (t)7.5

MISSATGE

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