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YHJ2M77120High-precision vertical double-sided grinding machine
ዋና ተግባር
YHJ2M77120 high-precision vertical double-sided grinding machine is a double-sided thinning machine independently developed and designed by Yuhuan Precision. The machine tool can be widely used in thin sheet parts made of non-metallic hard and brittle materials such as silicon carbide, quartz crystal, sapphire, etc., as well as double-sided thinning grinding of metal parts such as valve plates, valve plates, cylinder piston rings, oil pump blades, etc.
ምድብ: የምርት ማዕከል
ቁልፍ ቃላት: Yuhuan
የተለመዱ የማሽን ክፍሎች
ሲሊኮን ካርቦይድ
ኳርትዝ ክሪስታል
በጣም ሰማያዊ የከበረ ድንጋይ
የመሳሪያዎች ድምቀቶች
● The axial direction of the lower disc adopts the bearing structure of hydrostatic rotary table, which has the characteristics of high precision and high rigidity, and has good accuracy retention for high-pressure loading grinding processing.
● The inner and outer ring gear of the upper and lower discs adopts four-motor independent drive, and the process adjustment range is wide, and the process parameters can be flexibly adjusted according to different material products.
● The upper plate adopts a floating cylinder mechanism to adjust the balance, and the four groups of floating cylinders are arranged symmetrically and evenly to improve the processing efficiency on the premise of maintaining processing accuracy.
●The upper and lower plates have independent cooling channels to cool the grinding disc, and the upper and lower discs are equipped with multi-point temperature sensors (with wireless sensing), which control and adjust the refrigeration capacity through real-time temperature monitoring to ensure that the temperature of the grinding disc is uniform and constant.
● Equipped with online inspection system (optional), to achieve simultaneous processing and testing, high processing qualification rate.
ቴክኒካዊ መለኪያ
| ፕሮጀክት | መለኪያ | የልኬት |
| TTV of individual wafer substrate thickness | μm | ≤1.5 |
| The difference in thickness between wafer substrates | μm | ≤3 |
| Minimum wafer substrate thickness | μm | 350 |
| Wafer substrate flatness | μm | ≤1.5 |
| Wafer substrate chemical polishing roughness | Nm | 8ራ XNUMX |
| Upper and lower disc flatness | mm | ≤0.01 |
| Maximum loading pressure on the upper plate | t | 2 |
| Maximum stroke on the upper plate | mm | 500 |
| Upper polishing disc size | mm | Φ1140×Φ385×50 |
| The lower disc jumps | mm | ≤ |
| ዝቅተኛ የማጥራት ዲስክ መጠን | mm | Φ1140×Φ385×80 |
| External ring gear lift height | mm | 24-28 |
| Lower disc hydrostatic bearings have maximum load capacity | t | 7 |
| Upper disc speed | ሪች | 5-80 |
| ዝቅተኛ የዲስክ ፍጥነት | ሪች | 5-80 |
| Upper disc motor power | kW | 18.5 |
| Lower motor power | kW | 18.5 |
| Solar wheel rotational speed | ሪች | 5-100 |
| Solar wheel power | kW | 4.4 |
| External ring gear speed | ሪች | 1-26 |
| External ring gear motor power | kW | 4.4 |
| External ring gear motor power | ቁራጭ | 5 |
| Wafer processing specifications | ኢንች | ≤8”（For proofing）,6”（Commonly used |
| የመሣሪያ ክብደት | t | 4.5 |
